2nd-order HDI buried/blind via board

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Applications

Digital products and automotive electronics

Features

Material

TU-883

Layers

22 Layers

Thickness

1.6±0.16mm

Min Hole Size

Laser hole 0.1mm; mechanical hole 0.275mm

Min Track/Spacingh

100/100um

Minimum board thickness and hole ratio

12:1

Surface Finish

Immersion gold(ENIG) 0.05um

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Detalles del producto

The 2nd-order HDI buried/blind hole board is made of Taiyao TU-883 material through surface immersion gold and laser or mechanical drilling. The minimum hole diameter can reach 0.1mm, and the Min Track/Spacing can reach 100um. This type of HDI board is widely used in digital products and automotive electronics.

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Capacidades avanzadas de PCB

Estructura laminada multicapa

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FAQ sobre PCB

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Capacidad PCBA

recordatorios especiales

Requirimientos de archivos

FAQ Montaje PCB

Proceso de producción

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