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10-layer 2nd-order HDI board

Applications
Test
Features
Ladder board + ENEPIG + bonding
Material
S1000-2M
Layers
10 Layers
Thickness
1.3±0.13mm
Min Hole Size
Laser hole 0.1mm
Min Track/Spacingh
65/65um
Minimum board thickness and hole ratio
12: 1
Surface Finish
Immersion gold(ENIG) 50u"
Cotizar
Detalles del producto

10-layer 2nd-order HDI PCB circuit board, the whole board is produced by thick gold plating. It is widely used in chip testing in the field of artificial intelligence and 5G network communication. It is the first choice in the field of artificial intelligence and 5G network communication.

hdi-10-1.jpg

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