HDI PCBs - PCBWay

What is HDI PCB?

HDI PCB stands for High-Density Interconnect board. According to IPC-2226, HDI is defined as a printed circuit board with a wiring density per unit area higher than that of traditional printed circuit boards (PCBs). It is manufactured using micro-blind-buried via technology, resulting in high circuit distribution density. Therefore, HDI circuit boards are also referred to as buried blind via boards or blind and buried via circuit boards.

The Advantage of HDI PCB

Improved Reliability

Microvias, with their smaller aspect ratio, provide enhanced reliability compared to typical vias. They are more robust and utilize superior materials and components, resulting in excellent performance in HDI (High-Density Interconnect) technology.

Enhanced Signal Integrity

HDI technology employs via-in-pad, blind-via, and buried-via techniques, which bring components closer together, thereby reducing signal path lengths. By eliminating via stubs, HDI technology decreases signal reflection and improves signal quality, significantly enhancing overall signal integrity.

Cost-effectiveness

With proper planning, HDI technology can lower overall costs compared to standard PCBs. This is achieved through fewer layers, smaller dimensions, and a reduced number of required PCBs.

Compact Design

The use of blind and buried vias minimizes the space requirements of the circuit board.

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HDI PCB Manufacturing Capabilities

Feature	Capability
Via Types	Blind via, buried via, through-hole via
Number of layers	Up to 60 layers (evaluation required above 30 layers)
HDI builds	1+N+1, 2+N+2 , ... , 6+N+6（≥6 orders require evaluation）
Copper weights( finished）	18um-70um
Min trace/spacing	0.065mm/0.065mm
PCB thickness	0.1-8.0mm (evaluation required for less than 0.2mm or greater than 6.5mm)
Max. PCB dimension(finished)	2-20 layers, 21*33 inches; length ≤ 1000mm; evaluate if short side > 21 inches

Feature	Capability
Min. mechanical drilling	0.15mm
Min. laser drilling	Standard 4 mil, 3 mil require evaluation (corresponding to single 106PP).
Max. laser drilling	8 mil (corresponding dielectric thickness cannot exceed 0.15mm)
Min. controlled depth drilling	PTH: 0.15mm; NPTH: 0.25mm
Aspect ratio	Max 14:1; evaluate if greater.
Min. solder mask bridge	4mil(green, ≤1OZ） 5mil(other colors, ≤1OZ）
Diameter range of resin-filled vias	0.254-6.5mm

Common HDI PCB Stack-ups

Stack-up structures

Understanding different HDI PCB stack-up structures provides designers with greater flexibility in layer allocation, component placement, and routing options, enabling efficient utilization of available space and optimization of the PCB layout. The common HDI PCB stack-up structures are shown in the left diagram.

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Applications：	Car communication
Features：	2 times laser drilling, 3 times pressing, 2nd order HDI board
Material：	/
Layers:	14 Layers
Thickness：	1.6±0.16mm
Min Hole Size：	Laser hole 0.10mm; mechanical hole 0.20mm
Min Track/Spacingh：	75/75um
Minimum board thickness and hole ratio：	8:1
Surface Finish：	OSP

Applications：	Semiconductor test
Features：	/
Material：	S1000-2M
Layers：	8 Layers
Thickness：	4.4±0.4mm
Min Hole Size：	Laser hole 0.1mm; mechanical hole 0.3mm
Min Track/Spacingh：	127/85um
Minimum board thickness and hole ratio：	15:1
Surface Finish：	Immersion gold(ENIG) 0.05um

Applications：	/
Features：	/
Material：	A1000-2M
Layers：	8 Layers
Thickness：	2.5±0.25mm
Min Hole Size：	Laser blind hole 0.1mm; mechanical hole 0.25mm
Min Track/Spacingh：	127/127um
Minimum board thickness and hole ratio：	10:1
Surface Finish：	Immersion gold(ENIG) 0.05um

Applications：	5G Internet of Things
Features：	/
Material：	S1000-2M
Layers：	8 Layers
Thickness：	1.0±0.1mm
Min Hole Size：	Laser hole 0.1mm; mechanical hole 0.20mm
Min Track/Spacingh：	55/55um
Minimum board thickness and hole ratio：	8:1
Surface Finish：	Immersion gold(ENIG)+OSP

Applications：	Test
Features：	Ladder board + ENEPIG + bonding
Material：	S1000-2M
Layers：	10 Layers
Thickness：	1.3±0.13mm
Min Hole Size：	Laser hole 0.1mm
Min Track/Spacingh：	65/65um
Minimum board thickness and hole ratio：	12: 1
Surface Finish：	Immersion gold(ENIG) 50u"

Applications：	Digital products and automotive electronics
Features：	/
Material：	S1000-2M
Layers：	14 Layers
Thickness：	1.6±0.1mm
Min Hole Size：	Laser hole 0.15mm; mechanical hole 0.20mm
Min Track/Spacingh：	75/75um
Minimum board thickness and hole ratio：	8:1
Surface Finish：	Immersion gold(ENIG) 0.05um

Laser frequency：	1 time
Lamination frequency：	1 time
Layers：	4
Finished Copper：	2oz
Solder Mask：	None
Base material：	SYTECH
Thickness：	1.6mm
Min Hole Size：	0.2mm (Laser hole)

Laser frequency：	2 times
Lamination frequency：	3 times
Layers：	12
Finished Copper：	2oz
Solder Mask：	Matte black
Base material：	SYTECH
Thickness：	2.0mm
Min Hole Size：	0.2mm (Laser hole)

Layers：	6 layers

Laser frequency：	1 time
Lamination frequency：	1 time
Layers：	4
Finished Copper：	3oz
Solder Mask：	Purple
Base material：	SYTECH
Thickness：	1.4mm
Min Hole Size：	0.2mm (Laser hole)

Manufacturing Production Capacity

Upgrading of copper deposition line

Improve the process capability of PTH sunk copper (especially blind holes) to provide customers with high reliability products.

VCP copper plating line

Enhance copper plating capacity, improve copper plating uniformity, and have HDI hole filling capability.

4-wire flying probe tester

Better discriminate the product micro open circuit, micro short circuit, provide high precision resistance test requirements, make the product more reliable.

LDI laser direct imaging exposure machine

Achieves higher resolution while balancing the need for high alignment accuracy and high throughput.

Vacuum press

Enhance the effect of laminating rigid-flex PCBs and multilayer PCBs.

Laser equipment

Improve sample response speed as well as cover film,contour processing accuracy, with HDI laser drilling capability.

PCBWay's Advantages

PCBWay offers a wide range of PCB services, including flex, rigid-flex, and rigid PCB fabrication, ensuring that we can cater to diverse project requirements. We use top-grade materials and state-of-the-art equipment to guarantee optimal performance and reliability of their PCBs. PCBWay's commitment to quality, affordability, and customer satisfaction makes us a top choice for businesses and individuals seeking high-quality, customized, and reliable PCB fabrication services.

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Testing and Inspection Equipment

Salt spray tester

X-ray surface treatment thickness gauge

Metallographic section microscope

AOI inspection machine

Ion contamination tester

2D dimensional measuring instrument

Impedance tester

RoHS/HF tester

FAQ's

Why switch to HDI PCB design?

In cases of higher circuit complexity, using structures with blind and buried vias often achieves better yield and lower costs, providing advantages over traditional through-hole designs.

What is aspect ratio?

The aspect ratio in a PCB refers to the ratio of the depth of a hole to its diameter. It is commonly used to assess the manufacturability and performance of the hole. A higher aspect ratio indicates that the depth of the hole is greater relative to its diameter, which can pose challenges in the drilling and filling processes.

What is the range of laser drilling?

PCBWay can perform laser drilling with a minimum of 4 mil and a maximum of 8 mil.

What is the minimum PP thickness for laser blind vias?

In standard prototyping, the minimum PP thickness for laser blind vias is 0.06mm.

What is the minimum core thickness for laser blind vias?

In standard prototyping, the minimum core thickness for laser blind vias is 0.1mm.

HDI PCB Service

What is HDI PCB?

The Advantage of HDI PCB

Improved Reliability

Enhanced Signal Integrity

Cost-effectiveness

Compact Design

Common HDI PCB Stack-ups

Stack-up structures

Featured Product Solutions

Automotive communication 2nd-order HDI board

Semiconductor test 4th-order HDI board

3rd-order HDI board

3rd-order 5G IoT HDI PCB

10-layer 2nd-order HDI board

6th-order arbitrary interconnection HDI buried/blind via circuit board

4-layer high TG thick copper immersion silver board

12-layer high TG thick copper immersion gold board

HDI second-order 6-layer laser drilling immersion gold

4-layer high TG thick copper immersion gold board-Purple

Manufacturing Production Capacity

Order Online for PCB and PCB Assembly

FAQ's

Why switch to HDI PCB design?

What is aspect ratio?

What is the range of laser drilling?

What is the minimum PP thickness for laser blind vias?

What is the minimum core thickness for laser blind vias?

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