Prototipos de PCB de forma sencilla

Servicio completo para prototipos de PCB personalizados.

Centro de Ayuda
Enviando un mensaje
9:00 - 23:00, Mon.- Sun. (GMT+8)
Líneas directas de servicio
+86 571 8531 7532

9:00 - 18:00, Mon.- Fri. (GMT+8)

9:00 - 12:00, Sat. (GMT+8)

(Excepto los días festivos chinos públicos)

Ejemplo de placa de circuito impreso fabricada por nosotros.

Tenemos las capacidades de fabricación PCB para construir desde simples a complejas placas. Por favor, revise las placas de circuito impreso de ejemplo siguientes y háganos saber si tiene alguna pregunta o desearía una cotización formal.

原图
Pase el ratón para acercar

Industrial control 5th-order HDI board

Applications
Industrial Internet Control
Features
/
Material
S1000-2M
Layers
12 Layers
Thickness
1.8±0.18mm
Min Hole Size
Laser hole 0.1mm; mechanical hole 0.2mm
Min Track/Spacingh
127/127um
Minimum board thickness and hole ratio
9:1
Surface Finish
Immersion gold(ENIG) 0.05um
Cotizar
Detalles del producto

The industrial control 5th-order HDI circuit board is manufactured by laser drilling, surface immersion gold and other processes. The minimum aperture can reach 0.1mm, and the Min Track/Spacing can reach 127/85um. The HDI circuit board is widely used in the field of industrial Internet control.

hdi-13-1.jpg

Related Products Ver más >>
  • 7th-order arbitrary interconnection HDI buried/blind via circuit board

    The 7th-order HDI board is widely used in high-end smart phones and other fields

  • Mobile phone 3rd-order HDI board

    12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • Automotive communication 2nd-order HDI board

    14 layers, Thickness: 1.6±0.16, Surface Finish: OSP

  • Semiconductor test 4th-order HDI board

    8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm

  • Ipad 3rd-order HDI board

    8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • 10-layer 2nd-order HDI board

    10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm

  • 6th-order arbitrary interconnection HDI buried/blind via circuit board

    14 layers, Material: S1000-2M, Thickness: 1.6±0.1mm

  • 4th-order HDI buried/blind via board

    10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm

  • 3rd-order HDI board

    8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm

  • 3rd-order HDI PCB buried resistor circuit board

    8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm

  • 3rd-order 5G IoT HDI PCB

    8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

  • 2nd-order high speed PCB

    18 layers, Material: RO4350B+TU872SLK Rogers, Thickness: 3.2±0.32mm