Mobile phone 3rd-order HDI board

Productos PCB / HDI PCB / Mobile phone 3rd-order HDI board

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Applications

Smart phone

Features

Material

S1000-2M

Layers

12 Layers

Thickness

1.2±0.1mm

Min Hole Size

Laser hole 0.1mm

Min Track/Spacingh

65/65um

Minimum board thickness and hole ratio

Surface Finish

Immersion gold(ENIG)

Cotizar

Detalles del producto

The mobile phone's 3rd-order HDI PCB has a Min Track/Spacing of 65/65um and a minimum aperture of 0.1mm. This type of HDI circuit board is widely used in the field of smart phones.

Capacidades PCB

Capacidades avanzadas de PCB

Estructura laminada multicapa

Fabricación de PCB

Prototipado de PCB

Producción de bajo volumen

Proceso de producción

Productos PCB

FAQ sobre PCB

Capacidades PCBA

Capacidad PCBA

recordatorios especiales

Requirimientos de archivos

FAQ Montaje PCB

Proceso de producción

Productos de PCBA

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GaggiMate Controller

I ordered the PCB just last week, and it arrived in only six days—much faster than I expected. The production process was without any problems, and there were absolutely no issues during manufacturing or delivery. The quality of the board looks excellent, and it matches my design perfectly. This PCB will be invaluable for confirming all the details before committing to the full production run. I'm genuinely impressed with the speed and reliability of the service, and I’m excited to start working with it to validate my project. This quick turnaround has saved me a lot of time and effort in my development process.

Ullrich

Fragaria27 keyboard

Perfect work as always, thanks for bringing the project to life.

Gzowski

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Servicios de envío: FedEx,UPS,DHL,China Post Air Mail,TNT,EMS ePacket,Hongkong Post Air Mail,EMS

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