Prototipos de PCB de forma sencilla

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PCB Estructura laminada de multicapa

Cotización instantánea y pedido en línea.

4+6+4 HDI stackup Layer buildup/stackup reference

4+6+4 HDI PCB stackup

In the layer structure of a PCB board, there are several important concepts.
PP (Prepreg): Prepreg is a semi-cured sheet, also known as prepreg material, a thin sheet material that impregnated with resin and cured to an intermediate degree. It is mainly used as the bonding material and insulation material for inner conductive patterns of multilayer printed circuit boards. After being laminated with Prepreg, the semi-cured epoxy resin is squeezed out, begins to flow, and solidifies, bonding the multilayer circuit boards together and forming a reliable insulating layer. In the PCB industry, Prepreg can be likened to glue, used to bond several cores together using the lamination method to create multilayer boards.
PP Type:1080(3.1mil), 3313(4.2mil), 2116(5.4mil), 7628(7.7mil).

Core: Core is a rigid material with specific thickness and copper on both sides.
The pressing materials for multilayer boards mainly consist of Prepreg and Core.

The differences between the two are:
- Prepreg is a material used in PCBs, with a semi-solid texture similar to cardboard, while core is a rigid material similar to copper.
- Prepreg functions as both an adhesive and insulator, whereas core serves as the foundational material for PCBs, with entirely different functional roles.
- Prepreg can be flexible, while core cannot be bent.
- Prepreg is non-conductive, whereas core has copper layers on both sides, serving as the conductive medium for the printed circuit board.

In other special cases or Advanced PCBs (you need to choose "Customized Services and Advanced Options" and Custom stackup or Impedance control):
1. If you need custom stackup or control impedance, we will manufacture according to your requirement.
2. After place order,we will calculate whether it meets the requirements based on the stackup , material and impedance information.Also we will confirm with you.

For flexible PCB stackup, please check "Stack-up for FPC".

For rigid PCB, in response to customer demand, PCBWay has added a variety of laminate structures to our products (currently, we have added 298 and will continue to update them), which can greatly satisfy product structural design and impedance requirements.

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Nuestro servicio de atención al
cliente preparado para su PCB

+86-571-85317532
1.69GHz (1.7GHz) 2x2 patch array antenna for L-band satellite reception

Designed for L-band satellite reception using the designated FR-4 from PCBWay. Manufactured antenna nicely matches the simulated performance!

Boesen

Fragaria27 keyboard

Perfect work as always, thanks for bringing the project to life.

Gzowski

PCB standard stackup Total: 298
Layers
  • Please Select
  • 4 Layers
  • 6 Layers
  • 8 Layers
  • 10 Layers
  • 12 Layers
  • 14 Layers
  • 16 Layers
  • 18 Layers
Thickness (MM)
  • Please Select
  • 0.4MM
  • 0.6MM
  • 0.8MM
  • 1.0MM
  • 1.2MM
  • 1.6MM
  • 2.0MM
  • 2.4MM
Inner Copper (OZ)
  • Please Select
  • 0.5OZ
  • 1OZ
  • 1.5OZ
  • 2OZ
  • 3OZ
  • 4OZ
  • 5OZ
Outer Copper (OZ)
  • Please Select
  • 1OZ
  • 2OZ
  • 3OZ
  • 4OZ
  • 5OZ
Inner layer Residual copper ratio (%)
  • Please Select
  • 90%
  • 70%
  • 50%
  • 30%
Buscar
Reiniciar
Friendly Reminder: This is a through-hole board stack-up, not applicable for blind and buried vias. PCBWay supports customers to customize structures, and will continue to increase the structure diagrams.
4 Layers Total: 112
View all
1 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

SHOW MORE
6 Layers Total: 74
View all
1 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L6-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

4 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.2250
PP 2116 RC58%
DK:4.45 		0.1300
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L6-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.56mm, tolerance: ±10%

Finished PCB Thickness: 1.66mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

5 6-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

6 6-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.9
(Core with Cu)
CORE Core
DK:4.6 		0.8300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.9
(Core with Cu)
CORE Core
DK:4.6 		0.8300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.35mm, tolerance: ±10%

Finished PCB Thickness: 2.45mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

SHOW MORE
8 Layers Total: 49
View all
1 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

4 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

5 8-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

6 8-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

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10 Layers Total: 33
View all
1 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

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12 Layers Total: 12
View all
1 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0785
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0785
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

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14 Layers Total: 6
View all
1 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1935
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1935
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.2085
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.2085
PP 3313 RC58%
DK:4.45 		0.1030
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.97mm, tolerance: ±10%

Finished PCB Thickness: 2.07mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

16 Layers Total: 6
View all
1 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1760
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1760
PP 2116 RC58%
DK:4.45 		0.1300
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.39mm, tolerance: ±10%

Finished PCB Thickness: 2.49mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1760
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1760
PP 2116 RC58%
DK:4.45 		0.1300
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

18 Layers Total: 6
View all
1 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1935
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1935
PP 1080 RC68%
DK:4.21 		0.0810
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L16-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 0.5OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1213
L2-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L4-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L6-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L10-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L12-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L14-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1213
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L16-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

  • 4 Layers
  • 6 Layers
  • 8 Layers
  • 10 Layers
  • 12 Layers
  • 14 Layers
  • 16 Layers
  • 18 Layers
Front-end data preparation

01.PPE – Ingeniería pre producción

Los datos suministrados por el cliente (gerber) son utilizados para producir los datos para la placa en concreto (material gráfico para los procesos de imagen y datos de taladro para los programas de taladrado). Los ingenieros comparan los pedidos/especificaciones con las capacidades de producción para asegurarse el cumplimiento y también determinar los pasos del proceso y sus comprobaciones asociadas. No se permiten cambios sin el permiso del Grupo PCBWay.

Preparing

02.Corte de placas (corte de laminados revestidos de cobre)

La producción de PCB comienza con una gran pieza de material laminar. Debido a las limitaciones del equipo de producción de PCB y las capacidades de fabricación, la fábrica tiene requisitos para el tamaño de procesamiento mínimo y máximo. Por lo tanto, bajo la guía de instrucciones de fabricación (MI), la materia prima de PCB (laminado revestido de cobre) debe cortarse en el tamaño de procesamiento mediante una máquina de corte automático antes de la producción.

print icon

03.Imprimir capas internas

La Etapa 1 consiste en transferir la imagen utilizando una filmina a la superficie de la placa, utilizando lámina seca fotosensible y luz ultravioleta, que polimerizará la lámina seca expuesta por la filmina.<br> Este paso del proceso se realiza en una habitación limpia. Imaging – El proceso de transferir la información electrónica al foto-trazador, que utiliza luz para transferir una imagen negativa del circuito al panel o filmina.

etch icon

04.Atacado de las capas internas

La Etapa 2 consiste en eliminar el cobre no deseado del panel utilizando un atacado. Una vez que ese cobre ha sido eliminado, se retira el resto de la lámina seca quedando únicamente el circuito de cobre que coincide con el diseño. <br> Atacado – La eliminación química, o química y electrolítica, de porciones no deseadas de material conductivo o resistivo.

aoi icon

05.Inspección óptica automática de las capas interiores (AOI)

Inspección del circuito frente a la “imágenes” digitales para verificar que coincide con el diseño y que está libre de defectos. Se consigue a través de un escaneado de la placa que inspectores entrenados verificarán por si se detecta alguna anomalía.El Grupo PCBWay no permite reparaciones de circuitos abiertos.

Lamination icon

06.Apilado y pegado(Laminado)

Se aplica una capa de óxido a las capas internas que luego son apiladas conjuntamente con pre-preg que proporciona aislamiento entre las capas y se añada una capa de cobre a las partes superior e inferior del apilado.El proceso de laminado consiste en someter a las capas internas a una temperatura (375 grados Fahrenheit) y presión (de 275 a 400 psi) extremas mientras se laminan con un aislante seco fotosensible. Se somete la PCB a una cura a alta temperatura, se disminuye suavemente la presión y, entonces, se enfría lentamente el material.

drilling icon

07.Taladrando la PCB

Ahora debemos taladrar los orificios que crearán conexiones entre las múltiples capas.Se trata de un proceso de taladrado mecánico que debe ser optimizado para poder conseguir un registro exacto para cada una de las conexiones internas entre capas.Los paneles pueden apilarse durante este proceso. El taladrado también puede realizarse mediante láser.

copper icon

08.Deposiciónquímica de cobre

El primer paso en el proceso de plateado es la deposición química de una capa muy delgada de cobre en las paredes del interior de los orificios. El plateado pasante proporciona un depósito muy fino de cobre que cubre las paredes de los orificios y el panel por completo.Un proceso químico complejo que debe estrictamente controlado para permitir un depósito eficaz de cobre incluso en la pared no metálica de los orificios.Siendo aún una cantidad de cobre insuficiente, ya tenemos continuidad eléctrica entre capas y a través de los orificios. Tras el plateado pasante, se procede al plateado del panel para conseguir un depósito de cobre más grueso sobre el anterior – típicamente de 5 a 8 um.Esta combinación se utiliza para optimizar la cantidad de cobre que ha de ser plateada y atacada con e fin de alcanzar las demandas de pistas y espaciado.

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09.Proceso gráfico de capas exteriores

De forma similar al proceso de las capas internas (transferencia de la imagen utilizando lámina seca fotosensible, exposición a luz ultravioleta y atacado), pero con una diferencia principal – eliminaremos la lámina seca de los lugares donde deseemos mantener el cobre/definir el circuito – así podremos platear más cobre posteriormente en el proceso.
Este paso se realiza en una habitación limpia.

Plating icon

10.Plateado

Segunda etapa de plateado electrolítico, donde un plateado adicional se deposita en las áreas sin lámina seca /circuito). Una vez que se ha plateado el cobre, se aplica estaño para proteger el cobre.

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11.Atacado capas externas

Se trata normalmente de un proceso de tres pasos. El primer paso es eliminar la lámina seca azul. El segundo paso es el atacado del cobre expuesto/no deseado mientras el estaño depositado actúa como protector del cobre que deseamos mantener. El tercer y último pasoes eliminar químicamente el depósito de estaño dejando el circuito.

AOI

12.Inspección óptica automatizada de las capas externas

De manera similar a las capas internas, se escanea el panel atacado para asegurar que el circuito cumple con el diseño y está libre de defectos.De nuevo, no se permite la reparación de circuitos abiertos bajo la demanda de PCBWay.

Soldermask

13.Máscara de soldadura

La tinta de la máscara de soldadura se aplica sobre toda la superficie de la PCB. Utilizando filminas y lus ultravioleta se exponen ciertas áreas y las no expuestas se eliminan posteriormente durante el proceso de revelado químico –generalmente las áreas serán utilizadas como superficies para soldar.La máscara de soldadura restante se cura completamente obteniéndose un acabado elástico.<br> Este paso del proceso se realiza en una habitación limpia.

Surface finish

14.Acabado superficial

Entonces se aplican varios acabados a la superficie expuesta del cobre. Esto se realiza con el fin de proteger la superficie y conseguir una soldadura óptima. Los diferentes acabados pueden incluir Electroless Nickel Immersion Gold, HASL, plata por inmersión, etc. Se realizan comprobaciones de grosor y de soldadura.

Profile

15.Perfil

Este es el proceso de corte de los paneles fabricados a las medidas y formas especificadas basadas en el diseño del cliente como se definen en los archivos gerber. Hay tres opciones disponibles al proporcionar la matriz o vender el panel – marcado, enrutado o perforado. Todas las dimensiones se comparan con los gráficos aportados por el cliente para asegurarse de que el panel tiene las dimensiones adecuadas.

Electrical test

16.Comprobación eléctrica

Se utiliza para comprobar la integridad de las pistas y de las conexiones pasantes – comprobar que no existen circuitos abiertos o cortocircuitos en la placa terminada.Hay dos métodos de comprobación, sonda volante para pequeños volúmenes y para grandes volúmenes. Comprobamos eléctricamente cada PCB con los datos originales de la placa. Utilizando la sonda volante se comprueba cada red para asegurase de que está completa (sin circuitos abiertos) ni en corto con otras redes.

inspection

17.Inspección final

En el último paso del proceso, un equipo de inspectores de precisa vista dan a cada placa una delicada comprobación añadida. Comprobando visualmente la PCB con los criterios de aceptación y utilizando inspectores “aprobados” por PCBWay. Utilizando inspección visual manual y automática– compara la PCB con los gerber y es más rápida que la vista humana, pero aún requiere verificación humana. Todos los pedidos están también sujetos a una inspección completa, incluyendo dimensionado, capacidad de soldadura, etc.

Packaging

18.Empaquetado

Las placas se envuelven utilizando materiales de acuerdo con los requerimientos de empaquetado de PCBWay(ESD, etcétera) e introducidas en cajas antes de ser enviadas utilizando el método de transporte elegido.

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