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4th-order HDI buried/blind via board

Applications
Semiconductor test
Features
/
Material
S1000-2M
Layers
10 Layers
Thickness
2.2±0.2mm
Min Hole Size
Mechanical hole 0.2mm
Min Track/Spacingh
200/110um
Minimum board thickness and hole ratio
8.5:1
Surface Finish
Immersion gold(ENIG) 0.05um
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Detalles del producto

4th-order HDI buried blind hole PCB board, the smallest aperture can reach 0.1mm, the Min Track/Spacing can reach 200/110um. The HDI board is widely used in the field of semiconductor testing.

hdi-100-08.jpg

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