Printed Circuit Boards Glossary:Design,Fabrication and Assembly

A

1. 52 Acceptance Test 70%
2. 32 Accepted Quality Level (AQL) 70%
3. 44 Access Holes 70%
4. 44 Accuracy 70%
5. 40 Acrylic Resin 70%
6. 41 Activating 70%
7. 45 Additive Process 70%
8. 51 Adhesion Layers 70%
9. 44 Adhesive 70%
10. 72 Aging 70%
11. 41 Air Gap 70%
12. 55 Algorithm 70%
13. 41 Alkyd 70%
14. 48 Ambient 70%
15. 46 Analog Circuit 70%
16. 41 Analog Circuit Simulator 70%
17. 44 Analog Functional Test 70%
18. 50 Analog In-circuit Test 70%
19. 54 Anchoring Spur 70%
20. 42 Angle of Attack 70%
21. 54 Annotation 70%
22. 68 Annular Ring 70%
23. 63 ANSI 70%
24. 57 AOI 70%
25. 58 Aperture List 70%
26. 51 AQL 70%
27. 48 Aqueous Cleaning 70%
28. 93 Arc Resistance 70%
29. 48 Artwork 70%
30. 50 Artwork Master 70%
31. 53 ASCII 70%
32. 54 Aspect Ratio 70%
33. 69 Assembly Drawing 70%
34. 48 Assembly House 70%
35. 43 Assembly Language 70%
36. 45 ATE 70%
37. 45 Automated Component Insertion 70%
38. 35 Automatic Test Equipment 70%
39. 45 AWG 70%
40. 45 Axial Lead 70%
41. 47 Azeotrope 70%

B

1. 0 B&B 70%
2. 50 Backdriving 70%
3. 46 Backpanel (Backplane) 70%
4. 53 Bare Board 70%
5. 46 Barrel 70%
6. 47 Base Copper 70%
7. 48 Base Laminate 70%
8. 36 Base Material 70%
9. 58 Base Material Thickness 70%
10. 37 Base Solderability 70%
11. 43 Basic Wettability 70%
12. 54 BBT 70%
13. 44 Bed-of-Nails 70%
14. 46 Bellows Contact 70%
15. 67 BGA 70%
16. 40 Biscuit Frame 70%
17. 39 Bleeding 70%
18. 76 Blind Via 70%
19. 75 Blister 70%
20. 77 Blistering 70%
21. 45 Blow Hole 70%
22. 46 Bluetooth 70%
23. 45 Blutter Coat 70%
24. 52 Board Density 70%
25. 53 Board Thickness 70%
26. 50 Body 70%
27. 46 Bond Interface 70%
28. 54 Bond Lift-off 70%
29. 42 Bond Strength: 70%
30. 47 Bonding Layer 70%
31. 43 Bonding Time 70%
32. 43 Border Data 70%
33. 52 Boundary Scan 70%
34. 48 Bow 70%
35. 43 Branched Conductor 70%
36. 50 Brazing Alloy 70%
37. 49 Breakdown Voltage 70%
38. 45 Bridged Joint 70%
39. 51 Bridging 70%
40. 50 B-stage 70%
41. 69 B-stage Material 70%
42. 55 B-stage Resin 70%
43. 47 Bulge 70%
44. 57 Buried Via 70%
45. 37 Burn-in 70%
46. 42 Bus 70%
47. 40 Bus Bar 70%
48. 41 Bypass Capacitor 70%

C

1. 44 CAD system 70%
2. 0 CAD/CAM system 70%
3. 40 Capacitive Coupling 70%
4. 44 Capillary Action 70%
5. 42 CARD 70%
6. 40 Cast Adhesive 70%
7. 41 Catalyst 70%
8. 55 Chamfer 70%
9. 50 Characteristic Impedance 70%
10. 44 Check Plots 70%
11. 32 Chemical Conversion Coating 70%
12. 42 Chemical Hole Clearing 70%
13. 36 Chemically-deposited Printed Chip on board 70%
14. 42 Chip Testers 70%
15. 43 Circuit Tester 70%
16. 35 Circumferential Separation 70%
17. 45 Clad 70%
18. 49 Clad or Cladding 70%
19. 51 Clamshell Fixture 70%
20. 55 Class Transition Temperature 70%
21. 70 Clearance 70%
22. 74 Clearance Hole 70%
23. 40 Clinched-wire through Connection 70%
24. 41 Coating 70%
25. 47 COB 70%
26. 43 Coefficient of Expansion, Thermal-CTE 70%
27. 50 Cold Solder Connection 70%
28. 34 Compatibility 70%
29. 43 Compiler 70%
30. 44 Component 70%
31. 41 Component Density 70%
32. 41 Component Hole 70%
33. 38 Component side 70%
34. 42 Conductive Adhesive 70%
35. 46 Conductive Foil 70%
36. 46 Conductive Pattern 70%
37. 47 Conductor 70%
38. 66 Conductor Base width 70%
39. 48 Conductor Layer 70%
40. 61 Conductor Pattern 70%
41. 64 Conductor Side 70%
42. 46 Conductor Spacing 70%
43. 41 Conductor Thickness 70%
44. 38 Conductor Width 70%
45. 42 Conductor-to-hole Spacing 70%
46. 51 Conformal Coating 70%
47. 45 Connection 70%
48. 44 Connector Tongue 70%
49. 51 Contact Area 70%
50. 48 Contact Resistance 70%
51. 41 Contact Spacing 70%
52. 0 Contaminate/Contaminant 70%
53. 49 Continuity Testing 70%
54. 48 Copper Clad 70%
55. 49 Copper Foil-See Foil 70%
56. 52 Copper-mirror Test 70%
57. 45 Corner Mark 70%
58. 46 Corrosive Fluxes 70%
59. 60 Cosmetic Defects 70%
60. 50 Coupon 70%
61. 77 Cover Lay, Cover Layer, Cover Coat 70%
62. 58 Cracking 70%
63. 238 Crazing 70%
64. 45 Crimp Contact 70%
65. 35 Cross-hatching 70%
66. 46 Cross-linking 70%
67. 35 Cross-talk: 70%
68. 59 C-stage Material Laminate: 70%
69. 43 Cure 70%
70. 36 Current-carrying Capacity 70%
71. 49 Cut 70%
72. 45 Cycle Rate 70%

D

1. 45 Database 70%
2. 57 Datum 70%
3. 46 De-bugging 70%
4. 41 De-lamination 70%
5. 49 Dendrite 70%
6. 46 Design Width of Conductor 70%
7. 47 Device 70%
8. 50 De-wetting: 70%
9. 47 Dezincification 70%
10. 45 DFSM 70%
11. 42 Dice 70%
12. 46 Die 70%
13. 78 Dielectric 70%
14. 115 Dielectric Constant 70%
15. 61 Dielectric Strength 70%
16. 44 Digital Circuit 70%
17. 34 Digital Logic Simulator 70%
18. 52 Digitizing 70%
19. 45 Dimensional Hole 70%
20. 42 Dimensional Stability 70%
21. 55 DIP Soldering 70%
22. 36 Discrete Component 70%
23. 50 Dispersent 70%
24. 52 Disturbed Solder Connection 70%
25. 55 Documentation 70%
26. 37 Double-sided Assembly 70%
27. 49 Double-sided Board 70%
28. 48 DPF 70%
29. 45 Drag Soldering 70%
30. 54 Drag-out 70%
31. 138 DRC 70%
32. 56 Drills 70%
33. 46 Dross 70%
34. 56 Dry Film Resists 70%
35. 56 Drying Time 70%
36. 46 Dual Solder Wave 70%
37. 52 Dummy Component 70%
38. 53 Durometer 70%

E

1. 91 Edge Clearance 70%
2. 47 Edge Connector 70%
3. 64 Edge Spacing 70%
4. 57 Edge-board Contacts 70%
5. 47 Electroless Copper 70%
6. 45 Electroless Deposition 70%
7. 44 Electron-beam Bonding 70%
8. 54 Electroplating 70%
9. 45 Embedded Component 70%
10. 39 Emulsion Side 70%
11. 53 Entrapment 70%
12. 51 Epoxy Resins 70%
13. 48 Epoxy Smear 70%
14. 96 ERBGF 70%
15. 61 ERC 70%
16. 55 Escape Rate 70%
17. 53 ESD 70%
18. 62 ESD Sensitivity 70%
19. 116 Etch Factor 70%
20. 53 ETCH Resist 70%
21. 45 Etchant 70%
22. 72 Etch-back 70%
23. 46 Etched Printed Board 70%
24. 42 Etching 70%
25. 54 Exotherm 70%
26. 64 Extraneous Copper 70%
27. 54 Eyelet 70%

F

1. 53 Fault List 70%
2. 71 Feed-through 70%
3. 57 Fibre Exposure 70%
4. 51 FICS 70%
5. 96 Fiducial 70%
6. 59 Fillet 70%
7. 74 Fine Line Design 70%
8. 64 Fine Pitch 70%
9. 59 Finger 70%
10. 46 First Pass Yield 70%
11. 54 Fixture 70%
12. 53 Flat Cable 70%
13. 58 Flexible Printed Wiring 70%
14. 47 Flexure Failure 70%
15. 59 Flood Bar 70%
16. 61 Flow Soldering 70%
17. 74 Fluorocarbon 70%
18. 81 Flush Conductor 70%
19. 54 Flux 70%
20. 57 Flux Residue 70%
21. 81 Flux, Activated Rosin Flux 70%
22. 54 Flux-cored Solder 70%
23. 52 Foil 70%
24. 63 Footprint 70%
25. 42 Forced-air Convection 70%
26. 69 FR4 70%
27. 48 Fully-Additive Process 70%
28. 59 Functional Test 70%
29. 56 Fused Coating 70%

G

1. 47 Gas Blanket 70%
2. 65 Gerber 70%
3. 52 GI 70%
4. 56 Glass Epoxy 70%
5. 48 Glob Top 70%
6. 0 Go/No-Go Test 70%
7. 59 Grid 70%
8. 56 Ground Plane 70%
9. 65 Ground Plane Clearance 70%
10. 49 Guided Probe Method 70%
11. 56 Gull Wing Lead 70%

H

1. 51 H.D.I 70%
2. 53 Halides 70%
3. 51 Halogenated Polyester 70%
4. 82 Haloing Mechanically 70%
5. 55 HASL 70%
6. 50 Heat and Pull 70%
7. 47 Heat Sink 70%
8. 73 Heel，Bonding 70%
9. 63 Hipot Test 70%
10. 70 Hole Breakout 70%
11. 64 Hole Density 70%
12. 56 Hole Location 70%
13. 57 Hole Pattern 70%
14. 60 Hole Pull Strength 70%
15. 78 Hole Void 70%
16. 63 Hot Zone 70%
17. 64 Hygroscopic 70%

I

1. 57 IC 70%
2. 65 Immersion Plating 70%
3. 69 Impedance, Characteristic 70%
4. 60 In-circuit Test 70%
5. 66 Inclusion 70%
6. 74 Indentation 70%
7. 56 INDEX EDGE 70%
8. 60 Initiating 70%
9. 62 Inspection Lot 70%
10. 62 Inspection Overlay 70%
11. 77 Insulation Resistance 70%
12. 62 Inter-facial Connection 70%
13. 62 Inter-layer Connection 70%
14. 61 Internal Layer 70%
15. 127 Interstitial Via Hole 70%
16. 69 IPC 70%
17. 54 Isolation 70%

J

1. 60 J-leads 70%
2. 51 Jumper 70%
3. 56 Just-in-time(JIT) 70%

K

1. 58 Kapton 70%
2. 56 Key 70%
3. 73 Keying Slot or Polarizing Slot 70%
4. 63 Keyway 70%

L

1. 55 Laminate 70%
2. 65 Laminate Presses 70%
3. 69 Laminate Thickness 70%
4. 75 Laminate Void 70%
5. 65 Lamination 70%
6. 65 Land 70%
7. 66 Land Pattern 70%
8. 89 Landless Hole 70%
9. 68 Laser 70%
10. 63 Layer 70%
11. 70 Layer-to-Layer Spacing 70%
12. 73 LCCC 70%
13. 63 Lead 70%
14. 63 Lead Mounting Hole 70%
15. 67 Lead Projection 70%
16. 68 Legend 70%
17. 65 Lifted Land 70%
18. 61 Line 70%
19. 60 Liquation 70%
20. 62 Liquids 70%
21. 62 Load Test 70%
22. 75 Locating Edge, Locating Hole, Locating Notch, Locating Slot 70%
23. 105 Locating Hole, Locating Notch, Locating Slot 70%
24. 67 Logic diagram 70%

M

1. 70 Major Defect 70%
2. 62 Manhattan Distance 70%
3. 77 MAR(Minimum Annular Ring) 70%
4. 72 Margin 70%
5. 58 Mask 70%
6. 63 Mass Soldering 70%
7. 65 Master Artwork 70%
8. 69 Master Drawing 70%
9. 77 Master Pattern 70%
10. 94 Maximum, Plated Through-hole Size 70%
11. 71 MCR 70%
12. 90 Mean Time between Failure (MTBF) 70%
13. 101 Measling 70%
14. 60 MELF 70%
15. 61 Melting Range 70%
16. 87 Meniscus 70%
17. 65 Metal Clad Base Material 70%
18. 65 Metallization 70%
19. 88 Micro-sectioning 70%
20. 74 Micro-strip 70%
21. 70 Mil 70%
22. 76 Minimum Electrical Spacing 70%
23. 74 Minor Defect 70%
24. 69 Mis-registration 70%
25. 73 Mixed Component-Mounting Technology 70%
26. 71 Modifier 70%
27. 76 Module 70%
28. 67 Mother Board 70%
29. 79 Mounting Hole 70%
30. 63 Muffle 70%
31. 79 Multi-layer PCB 70%
32. 77 Multimeter 70%
33. 69 Multiple-image Production Master 70%

N

1. 94 Nail Heading 70%
2. 62 Negative (Noun) 70%
3. 77 Negative–acting Resist 70%
4. 68 Netlist 70%
5. 67 Neutralizer 70%
6. 84 NFP 70%
7. 70 Node 70%
8. 62 Non-clean solder 70%
9. 64 Non-conductive Epoxy 70%
10. 61 Non-conductive Pattern 70%
11. 97 Non-functional Land 70%
12. 64 Non-polar Compound 70%
13. 65 Non-wetting 70%
14. 86 NPTH 70%

O

1. 64 Omegameter 70%
2. 58 One-sided Board 70%
3. 64 Open 70%
4. 74 Organic Activated (OA) 70%
5. 95 OSP 70%
6. 94 Outgassing 70%
7. 77 Outgrowth 70%
8. 104 Overhang 70%

P

1. 84 Packaging Density 70%
2. 71 Pad 70%
3. 139 Panel 70%
4. 87 Panel Plating 70%
5. 80 Parylene 70%
6. 73 Pattern 70%
7. 84 Pattern Plating 70%
8. 86 PCB 70%
9. 81 PEC 70%
10. 136 Peel Strength 70%
11. 100 Permanent Mask 70%
12. 79 Photomaster 70%
13. 128 Photoplotter 70%
14. 121 Photopolymer 70%
15. 83 Physical Layer 70%
16. 100 Pick-and-place Machine 70%
17. 105 PIH Assembly 70%
18. 113 Pilot Hole 70%
19. 82 Pin 70%
20. 196 Pin Density 70%
21. 87 Pinhole 70%
22. 96 Pinholes 70%
23. 159 Pink Ring 70%
24. 109 Pit 70%
25. 125 Pitting 70%
26. 99 Plate Finish 70%
27. 157 Plated Through-hole 70%
28. 105 Plating 70%
29. 135 Plating Bar 70%
30. 109 Plating Resists 70%
31. 95 Plating Up 70%
32. 92 Plotting 70%
33. 94 Poise 70%
34. 106 Polarization 70%
35. 103 Polyester 70%
36. 184 Polyimide 70%
37. 103 Polyimide Resins 70%
38. 135 Populated PCB 70%
39. 154 Positive (noun) 70%
40. 99 Positive-acting Resist 70%
41. 102 Pre-heat 70%
42. 110 Prepreg 70%
43. 91 Press-fit Contact 70%
44. 109 Primer 70%
45. 97 Printed Board 70%
46. 102 Printed Board Assembly 70%
47. 97 Printed Circuit 70%
48. 103 Printed Circuit Assembly 70%
49. 105 Printed Component 70%
50. 100 Printed Contact 70%
51. 104 Printed Wiring 70%
52. 113 Printed Wiring Assembly Drawing 70%
53. 117 Printed Wiring Board 70%
54. 107 Printed Wiring Layout 70%
55. 104 Probing Systems 70%
56. 121 Process Indicator 70%
57. 100 Production Master 70%
58. 106 PTH 70%
59. 114 Pull Strength 70%
60. 115 PWB 70%

Q

R

1. 108 Radial Lead 70%
2. 109 Reference Edge 70%
3. 114 Re-flow Soldering 70%
4. 126 Re-flow Spike 70%
5. 116 Re-flowing 70%
6. 105 Register Mark 70%
7. 121 Registration 70%
8. 109 Relative Humidity 70%
9. 109 Reliability 70%
10. 118 Repair 70%
11. 122 Repeatability 70%
12. 114 Residue 70%
13. 120 Resin 70%
14. 138 Resin Smear 70%
15. 118 Resist 70%
16. 133 Reverse Image 70%
17. 130 Re-work 70%
18. 127 Re-working 70%
19. 135 Rheology 70%
20. 128 Ribbon Cable 70%
21. 132 Right-angle Edge connector 70%
22. 130 Roadmap 70%
23. 121 Rosin 70%
24. 124 Rosin Flux 70%

S

1. 128 Saponifier 70%
2. 124 Schematic Diagram 70%
3. 118 Screen 70%
4. 127 Screen Printing 70%
5. 206 Semi-additive process 70%
6. 114 Semi-aqueous Cleaning 70%
7. 132 Sensitizing 70%
8. 138 Shadowing 70%
9. 128 Shielding, Electronic 70%
10. 121 Shingle-sided Board 70%
11. 137 Short 70%
12. 116 Signal 70%
13. 117 Signal Conductor 70%
14. 113 Signal Plane 70%
15. 141 Silkscreen 70%
16. 118 Simulation 70%
17. 122 Single-image Production Master 70%
18. 132 Slump 70%
19. 129 SMD 70%
20. 168 Smear 70%
21. 141 SMOBC 70%
22. 115 SMT 70%
23. 209 Snap-off 70%
24. 144 Snap-off Distance 70%
25. 118 Soak 70%
26. 155 Solder (Soft) 70%
27. 130 Solder Bridging 70%
28. 134 Solder Connection Pinhole 70%
29. 136 Solder Fillet 70%
30. 122 Solder Levelling 70%
31. 138 Solder Mask, Solder Resist 70%
32. 127 Solder Masks 70%
33. 169 Solder oil (Blanket) 70%
34. 130 Solder Paste 70%
35. 123 Solder Plug 70%
36. 155 Solder Projection 70%
37. 133 Solder Resist 70%
38. 140 Solder Side 70%
39. 128 Solderability 70%
40. 140 Solderability Testing 70%
41. 126 Soldering 70%
42. 127 Soldering Iron Tip 70%
43. 133 Solderless Wrap 70%
44. 122 Solidus 70%
45. 116 Spurious Signal 70%
46. 119 Stamped Printed Wiring 70%
47. 160 Statistical Process Control(SPC) 70%
48. 122 Step Soldering 70%
49. 140 Step-and-repeat 70%
50. 122 Straight-through Lead 70%
51. 124 Strain 70%
52. 127 Stripline 70%
53. 126 Substrate 70%
54. 171 Subtractive Process 70%
55. 165 Supported Hole 70%
56. 176 Surface Insulation Resistance(SIR) 70%
57. 208 Surface Insulation Resistance(SIR)Test 70%
58. 117 Surface Leakage 70%
59. 124 Surface Mounting 70%
60. 131 Surface Tension 70%
61. 111 Surfactant 70%
62. 138 Swaged Lead 70%

T

1. 137 Tape-and-reel 70%
2. 133 Taped Components 70%
3. 133 Teflon 70%
4. 144 Temperature Profile 70%
5. 210 Tented Via 70%
6. 233 Tenting 70%
7. 147 Terminal Area 70%
8. 129 Termination 70%
9. 134 Terpenes 70%
10. 135 Test Board 70%
11. 225 Test Coupon 70%
12. 137 Test Fixture 70%
13. 170 Test Pattern 70%
14. 137 Test Point 70%
15. 137 Thermocouple 70%
16. 147 Thermoplastic 70%
17. 134 Thermoset 70%
18. 129 Through Connection 70%
19. 131 Tinning 70%
20. 130 Tolling Hole 70%
21. 139 Tombstoning 70%
22. 131 Trace 70%
23. 140 Traces 70%
24. 140 Transmission Cable 70%
25. 146 Transmission Line 70%
26. 131 Triazine 70%
27. 125 Trim Lines 70%
28. 130 Twist 70%

U

1. 127 UL 70%
2. 131 Ultrasonic Soldering 70%
3. 177 Undercut 70%
4. 144 Underwriters’ Symbol 70%
5. 149 Unsupported Hold 70%

V

1. 234 Vacuum Pick-up 70%
2. 337 Vapour Phase 70%
3. 385 Via 70%
4. 402 Via Hole 70%
5. 498 Virtual Prototype 70%
6. 354 Viscosity 70%
7. 543 Void 70%
8. 400 Voltage Plane 70%

W

1. 404 Wave Exposure 70%
2. 424 Wave Soldering 70%
3. 475 Weave Exposure 70%
4. 480 Wetting 70%
5. 564 Whisker 70%
6. 592 Wicking 70%

X

Y

1. 586 Yield 70%

Z

1. 715 Z-Stroke 70%