5G mobile phone PCB motherboard

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Applications

5G mobile phone

Features

Material

S1000-2M

Layers

12 Layers

Thickness

1.2±0.1mm

Min Hole Size

Min Track/Spacingh

65/65um

Minimum board thickness and hole ratio

Surface Finish

Immersion gold(ENIG)+OSP

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Detalles del producto

The 5G mobile phone PCB motherboard is made of Shengyi S1000-2M material through surface immersion gold, laser drilling and OSP processes. This type of HDI circuit board is widely used in the field of smart phones.

Capacidades PCB

Capacidades avanzadas de PCB

Estructura laminada multicapa

Fabricación de PCB

Prototipado de PCB

Producción de bajo volumen

Proceso de producción

Productos PCB

FAQ sobre PCB

Capacidades PCBA

Capacidad PCBA

recordatorios especiales

Requirimientos de archivos

FAQ Montaje PCB

Proceso de producción

Productos de PCBA

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c64 pla replacement

boards came very well packaged and built very well. i am pleased. you have definitely mastered the skills for pcb and it's a very fast and reliable project. this was my second pcb project and I am pleased with the results. it's also a very fast process to get pcb's built by you. I will order more pcb's from you.

Engineer

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